Copper embodied
D Ryba 12/14/2001
Swiftech's new MCXC370 is specifically designed for excessive CPU operating conditions in all AMD socket A, and Intel socket 370 motherboards.
The MCXC370 has a 1/2" thick base, which is made of C110 copper instead of Aluminum. Designated C103, (Cu-OF or CW008A), this copper is made only by casting in a controlled atmosphere. It can subsequently be worked exactly as normal high conductivity copper. The copper base offers a heat capacity increase of 40% compared to the all aluminum version. This translates into two possible types of environments, which are CPU overclocking frequencies, and extremely low noise levels at CPU factory settings. Additional pictures can be found here.
The essential features of the new MCXC370 are unquestionably it "Helicoid" Pin design, Fan Mounting, and Clip Mounting. Lest take a look at the MCXC370's accoutrements:
Helicoid Pin Design:
The Helicoid or parabolic spiral is a design, which is intended to increase the pin surface area by a ratio a 2:1 compared to the traditional plain pins. The design is generated by a straight line moving in such a manner that every point of the line shall have a uniform motion in the direction of another fixed straight line, and at the same time a uniform angular motion about it. By Increasing, the surface area improves thermal dissipation (more surfaces available to dissipate heat in the environment). The spiral design also promotes locally accelerated airflow velocity, which further improves the mixing of the radiated heat into the environment.
Fan Mounting System:
Due to the pin configuration, Swiftech recommends that the heatsink perform best with the fan blowing downwards. Interestingly, the fan is mounted on rubber spacers, raising it .190" (48mm) above the heatsink. This translates into a 1 degree Celsius performance gain, but more importantly, this is intended to reduce noise. In addition, a benefit by implementing rubber spacers between the fan and heat sink is the minimizing of vibrations produced by the fan. The improvement is approximately 1 to 2 decibels.
Three Tab Clip Mounting System:
With the exception of performance, the mounting system is by far, the most impressive feature of the MCXC370. The MCXC370 comes with two retaining clips, which attach to the sides of the socket A, or socket 370. These provide disproportionate length compression springs, which meet AMD and Intel Heat Sink to CPU pressure specifications. The new three-tab clip does a superb job at securely maintaining the HSF against the CPU during normal operations. With the likes of TaiSol and a few other manufacturers, I was delighted to see such a balanced mounting system.
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Installation:
From Alpha's PAL8045 to Zalman's CNPS 6000A heatsink, I have never installed a heatsink with such ease as I had with the MCXC370. This is especially impressive because we installed two of these in Tyan's dual processor Thunder K7 motherboard. 
Referencing the enclosed pictures, one can see the two sockets are surrounded by a horde of resistors. As with most heatsinks, one must angle the heatsink to fit one side of the clip. Then, while applying pressure to one side, the second clip must be negotiated on the other side, while avoiding those cumbersome transistors and resistors. Additionally, most heatsinks require a steady hand with a screwdriver to fasten the clip. The beauty with the MCXC370 is that it is simply fitted on top of the CPU/socket with little or no force whatsoever. The clips are designed to directly line up with the socket. Simply rest the retaining clips over the three socket connectors and adjust the tension of the springs and your done. The whole process to install two of the MCXC370's was less then three minutes.
Criteria:
Using Omega's excellent model HH-22 digital thermometer, we affixed one of the beaded wire probes closely to the processor core. We used the fashionable Prime 95 to stress the CPU on Tyan's Thunder K7 dual processor motherboard and Arctic Silver II thermal grease in all tests. We opted to record only CPU 0 temperatures because CPU 1 resides directly over the AGP port and does not receive as efficient cooling as CPU 0. Therefore, the heat generated by the AGP port will distort the results of CPU 1.
