I would like to share a tidbit about the new Xeon heat sink that comes with the retail version of the Xeon 800FSB Processors. In an era where people fancy products that are smaller, thinner, and lighter, Intel took an opposite approach when they designed their new heat sinks. Intel's new heat sink is 2.39lbs (the heaviest I have ever seen) compared to an AMD Opetron heat sink that is 0.88lb.
Xeon Heatsink
Opteron Heatsink
Let me explain why this is relevant.
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Now if you mount a motherboard that is about 7lbs vertically to the chassis of the case, which is a thin piece of metal, what do you think will happen when you ship it? Well here are some scenarios on what could happen.
Xeon Combo
Opteron Combo
First, the heat sink may come loose and you have a 2lb object rattling around in the case that will damage the motherboard, processor, RAM, video card, and/or the hard drive.
Second, if it survives shipping, the total weight of the motherboard could bend or break the chassis where it is mounted and again damage the components mentioned above.
Third, with the thermal paste adhering the heat sink to the processor, should the mounting brackets fail, the weight of the heat sink could break the die off of the pins on the processor, not only destroying the processor but also killing the motherboard.
As we all know Xeon systems don't come cheap and if someone decides to buy one, the last thing they want to worry about is something coming loose or breaking due to the weight of the heat sink, the least technologically advanced component in the system. After encountering this issue, I was stunned that the engineers at Intel didn't factor this into their test process. I hope that I'm not the only one that had this problem and hope that this will turn enough heads at Intel and get them to redesign the Xeon heat sink.
Until then I guess I will be getting an AMD Opteron system.
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